Cooling
We’re trusted partners in planning, designing, building and operating modern and AI ready data centres. Combining sustainability consultancy and broad data centre domain expertise, we’re delivering future-ready flexible data centres.
Maximise AI performance with precision liquid cooling.
Liquid-to-liquid coolant distribution units deliver scalable, high-efficiency liquid cooling for AI and High Performance Computing (HPC) environments. With built-in redundancy and Programmable Logic Controller (PLC) controls, they ensure uptime, adaptability, and future-ready performance for new or retrofit AI factories.
- Sustainability: Designed with eco-efficiency in mind, utilising advanced technologies to minimise energy consumption while maintaining peak performance.
- Efficiency: Designed with the awareness that low energy consumption is the result of an exhaustive analysis, from the choice of components to the constant refinement of design solutions.
- Reliability: A fundamental requirement for each data centre, achieved thanks to the design and implementation of cooling systems.
- High Temperature Design: The continuous cooling is guaranteed by the high outdoor temperature, and the efficiency is maximised thanks to high water temperatures.
The end-to-end solution to support the transition from low densities air-cooled datacenters to AI liquid cooled next generation.
Liquid cooling is an architecture in which Coolant Distribution Units (CDUs) are the backbone, between servers and heat rejection units. As AI workloads push the boundaries of performance, CDUs deliver the precision and reliability needed to keep critical infrastructure running at highest efficiency.
- Liquid to Liquid CDUs ensure flow control, temperature control, and pressure control to the Technology Cooling System (TCS), as well as fluid treatment, filtration and quality.
- Liquid to Air CDUs, are an alternative solution which allows liquid cooling servers to be used in an air based white space.
- Manifolds distribute fluid throughout servers, ensuring a consistent flow of cooling.
- Cold plates reject chip heat into the fluid distribution, maintaining the device’s optimal operating temperature.
No matter the size of your deployment, from traditional densities to extra high densities (200kW+), we have the solution to enable your deployment.
Air-cooled heat removal for liquid-cooled computing. Heat dissipation unit enables liquid-cooled computing systems to operate without building-supplied cooling water. Positioned near the racks, it uses high-efficiency fans and intelligent controls to remove heat, ensuring reliable performance in any environment.
Rack-level cooling for AI and advanced computing. ChilledDoor® system delivers powerful, energy-efficient cooling directly at the rack, whilst maintaining room-neutral conditions. Compatible with all standard racks, it ensures seamless integration and reliable performance for high-density environments.
Integrated cooling solutions, including headers and in-rack manifolds, custom hose kits, and advanced chip-level cold plates, designed to streamline installation, enhance thermal performance, and ensure reliable, scalable liquid cooling for new or retrofit AI data centres.
