Liquid cooling has become essential for high-performance accelerated computing. Air cooling was practical when chip densities were lower. Yet, these densities have skyrocketed, placing more pressure on traditional air cooling until it become increasingly unmanageable. So, new approaches for heat removal are needed to avoid the risk of hot spots that lead to equipment failure and downtime
Date:
04 Dec 2024|Type:
Catalog
Languages:
English|Version:
1.0
Document Reference:
Liquid_Cooling_998-23684269
Files
File Name
998-23684269 - Liquid Cooling One-Pager Layout for Introduction_XA1_WEB.pdf