Liquid cooling has become essential for high-performance accelerated computing. Air cooling was practical when chip densities were lower. Yet, these densities have skyrocketed, placing more pressure on traditional air cooling until it become increasingly unmanageable. So, new approaches for heat removal are needed to avoid the risk of hot spots that lead to equipment failure and downtime
日付:
04 12月 2024|タイプ:
Catalog
言語:
英語|バージョン: 1.0
ドキュメントを参照:
Liquid_Cooling_998-23684269
ファイル
[ファイル名]
998-23684269 - Liquid Cooling One-Pager Layout for Introduction_XA1_WEB.pdf