A flooring solution for technical rooms such as data centers, with a special structure that meets all the needs for high floors and heavy loads, ventilation or cooling requirements, and flexibility of the underneath space. Two types of panel core are available, both with aluminium foil on lower side and HPL on top.
AdaptabilityHigh Density Wooden Chipboard Core - The best combination of mechanical properties and contained weights for an economic purchase and ease of installation.Aluminum Backing - The back of the core panel is covered to further improve mechanical characteristics and increase thermal hygrometric stability.TR Pedestal Structure - Made from galvanized steel supports, these structures are available in different heights from 30 cm up to 150 cm and beyond. Together, they make a 60x60 cm support grid for the panels and they increase the mechanical resistance and stability of the floor. The support heads and steel frames are designed to be fastened to each other anywhere along the perimeter to enable support at higher distances and to have more freedom in installing any data center system in the under floor plenum.Plastic Laminate Finish - The top of the core panel is covered in high pressure plastic laminate for added aesthetic value.