Equipment with side-to-side airflow presents special cooling challenges in the modern data center. Common rack enclosures and rack layouts are fundamentally incompatible with side-to-side cooling, resulting in excessive temperatures and ultimately reduced equipment reliability. This paper describes these challenges along with several side effects that are generally not appreciated. Various cooling options are described along with their relative costs and benefits.
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SADE-5TNRKJ_R1_EN.pdf
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