Instruction Sheet for A9A26924
Increasing IT chip densities, a focus on energy efficiency, and new IT use cases like harsh edge computing environments are driving the interest and adoption of liquid cooling. In this paper we present the fundamentals of liquid cooling, describe the advantages over conventional air cooling, and explain the 5 main direct to chip and immersive methods. To help guide the selection of the appropriate liquid cooling method for a given need, we explain the key attributes that must be considered.
Date:
03 July 2019
|
Type:
White paper
Languages:
English
|
Version:
V0
Document Reference:
SPD_VAVR-AQKM3N_EN
Files
File Name
VAVR-AQKM3N_R0_EN.pdf
Related products
Increasing IT chip densities, a focus on energy efficiency, and new IT use cases like harsh edge computing environments are driving the interest and a...
Date:
03 July 2019
Type:
White paper
Languages:
English
Version:
V0
Files
File Name
VAVR-AQKM3N_R0_EN.pdf
Related products