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BMEP584040S
Environmental Data
Total lifecycle Carbon footprint
246
Use Better
Packaging made with recycled cardboard
Yes
Use Again
Take-back
No
This processor module is part of the Modicon M580 range, an offer of PACs and safety PLCs with built-in Ethernet. This processor module offers a maximum of 8 rack configuration and 144 application specific channels. It is a processor module with a current consumption of 295mA at 24V DC. It supports 4096 discrete, 1024 analog local I/O channels and 64 distributed equipment. It is furnished with Ethernet TCP/IP for service port, 2 Ethernet TCP/IP for device network and USB type mini B for integrated connections. It has an integrated RAM of 16MB for program, 2048kb for data, 10kb for system memory and expandable flash of 4GB for data storage. It is an IP20 rated product. It weighs 0.849kg. It is suitable for medium to large process applications. Modicon M580 improves reliability and sustainability, as well as productivity with high performance and increases operating profitability due to efficient access to data. Modicon M580 ePAC is the controller which can help hybrid manufacturers achieve better, measurable and earlier ROI.
| Range of product | Modicon M580 |
|---|---|
| Product or component type | Processor module |
| Impregnation material | Conformal coated |
| Number of racks | 8 |
|---|---|
| Local I/O processor capacity (discrete) | 4096 I/O |
| Local I/O processor capacity (analog) | 1024 I/O |
| Number of application specific channel (local rack) | 144 |
| Application specific I/O | Counter Motion control SSI encoder Accurate time stamping Serial link HART |
| Checks | Safety control Process control |
| Control channels | Programmable loops |
| Integrated connection type | 1 Ethernet TCP/IP for service port 2 Ethernet TCP/IP for device network USB type mini B |
| Number of remote I/O station | 16 - 2 rack(s) per remote drop |
| Number of distributed equipment | 64 |
| Number of CIP safety IO devices | 64 |
| Communication module processor capacity | 16 AS-Interface module 4 Ethernet communication module |
| Communication service | RIO scanner DIO scanner |
| Memory description | Expandable flash, 4 GB for data storage Integrated RAM, 10 kB for system memory Integrated RAM, 16 MB for program process Integrated RAM, 2048 kB for data process Integrated RAM, 4 MB for program safety Integrated RAM, 1024 kB for data safety |
| Application structure | 2 auxiliary tasks 1 periodic safe task 128 event tasks 1 periodic fast task 1 cyclic/periodic master task |
| Cybersecurity | Achilles certified DoS prevention IPSec SNMP logging Syslog protocol support Audit trail Embedded firewall Firmware signature Password protection Port hardening Security log |
| Number of instructions per ms | 30 Kinst/ms 65 % Boolean + 35 % fixed arithmetic 40 Kinst/ms 100 % Boolean |
| Current consumption | 295 mA at 24 V DC |
| MTBF reliability | 775000 H |
| Marking | CE |
| Vibration resistance | 3 gn |
|---|---|
| Shock resistance | 15 gn |
| Ambient air temperature for operation | -25…60 °C |
| Ambient air temperature for storage | -40…85 °C |
| Operating altitude | 0...2000 m 2000...5000 m with derating factor |
| Relative humidity | 5…95 % at 55 °C without condensation |
| IP degree of protection | IP20 |
| Directives | 2014/30/EU - electromagnetic compatibility 2006/42/EC - machinery 2014/34/EU - ATEX directive |
| Product certifications | CE UL CSA RCM EAC Merchant Navy ATEX zone 2/22 IECEx zone 2/22 TÜV |
| Standards | IEC 61131-2 IEC 61010-2-201 UL 61010-2-201 CSA C22.2 No 61010-2-201 IACS E10 EN/IEC 61000-6-5, interface type 1 and type 2 EN/IEC 61850-3, location G IEC 60079-0 |
| Environmental characteristic | Hazardous location class I division 2 Gas resistant class Gx conforming to ISA S71.04 Gas resistant class 3C4 conforming to IEC 60721-3-3 Dust resistant class 3S4 conforming to IEC 60721-3-3 Sand resistant class 3S4 conforming to IEC 60721-3-3 Salt resistant level 2 conforming to IEC 68252 Mold growth resistant class 3B2 conforming to IEC 60721-3-3 Fungal spore resistant class 3B2 conforming to IEC 60721-3-3 |
| Protective treatment | Conformal coating |
| Safety level | SIL 3 conforming to IEC 61508 SIL 3 conforming to IEC 61511 SILCL 3 conforming to IEC 62061 SILCL 3 conforming to ISO 13849-1 category 4 SIL 4 conforming to EN 50126 SIL 4 conforming to EN 50128 SIL 4 conforming to EN 50129 |
| Supply | Internal power supply via rack |
| Status LED | 1 LED (green) processor running (RUN) 1 LED (red) processor or system fault (ERR) 1 LED (red) I/O module fault (I/O) 1 LED (green) download in progress (DL) 1 LED (red) memory card or CPU flash fault (BACKUP) 1 LED (green/red) ETH MS (Ethernet port configuration status) 1 LED (green/red) Eth NS (Ethernet network status) 1 LED (green) processor in safety mode (SRUN) 1 LED (green) processor in maintenance mode (SMOD) 1 LED (red) I/O values overrided by user (FORCED IO) |
| Net weight | 0.849 kg |
| Unit Type of Package 1 | PCE |
|---|---|
| Number of Units in Package 1 | 1 |
| Package 1 Height | 8.900 cm |
| Package 1 Width | 17.800 cm |
| Package 1 Length | 25.200 cm |
| Package 1 Weight | 880.000 g |
| Unit Type of Package 2 | S03 |
| Number of Units in Package 2 | 6 |
| Package 2 Height | 30.000 cm |
| Package 2 Width | 30.000 cm |
| Package 2 Length | 40.000 cm |
| Package 2 Weight | 5.758 kg |
Schneider Electric aims to achieve Net Zero status by 2050 through supply chain partnerships, lower impact materials, and circularity via our ongoing “Use Better, Use Longer, Use Again” campaign to extend product lifetimes and recyclability.
Total lifecycle Carbon footprint
246
Environmental Disclosure
Use Better
Packaging made with recycled cardboard
Yes
Packaging without single use plastic
No
Pro-active compliance (Product out of EU RoHS legal scope)
SCIP Number
4eb70ab0-978b-4773-a441-0cc20d6144a1
REACh Regulation
Use Again
End of life manual availability
Take-back
No
CPU Module Only
Modules Mounted on Racks
a: additional space below the rack to accommodate the height of the CPU. For an X Bus rack, the value is 30.9 mm (1.217 in.); for an Ethernet rack, the value is 29.49 mm (1.161 in.).
b: the height of the rack. For an X Bus rack, the height is 103.7 mm (4.083 in.); for an Ethernet rack, the height is 105.11 mm (4.138 in.).
c: the height of the main local rack, 134.6 mm (5.299 in.)
Modules and Cables Mounted in an Enclosure
a: enclosure depth: 135 mm (5.315 in.)
b: wiring + module depth: > 146 mm (5.748 in.)
c: wiring + module + DIN rail depth: > 156 mm (6.142 in.)
d: rack height: for an X Bus rack 103.7 mm (4.083 in.); for an Ethernet rack, 105.11 mm (4.138 in.)
e: module height: 134.6 mm (5.299 in.)
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