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BMEP586040C
Environmental Data
Total lifecycle Carbon footprint
250
Use Better
Packaging made with recycled cardboard
Yes
Use Again
Take-back
No
| Range of product | Modicon M580 |
|---|---|
| Product or component type | Processor module |
| Impregnation material | Conformal coated |
| Number of racks | 8 |
|---|---|
| Local I/O processor capacity (discrete) | 6144 I/O |
| Local I/O processor capacity (analog) | 1536 I/O |
| Number of application specific channel (local rack) | 216 |
| Application specific I/O | Serial link HART Motion control Accurate time stamping SSI encoder Counter |
| Checks | Process control |
| Control channels | Programmable loops |
| Integrated connection type | 1 Ethernet TCP/IP for service port 2 Ethernet TCP/IP for device network USB type mini B |
| Number of remote I/O station | 31 - 2 rack(s) per remote drop |
| Number of distributed equipment | 64 |
| Communication module processor capacity | 6 Ethernet communication module 16 AS-Interface module |
| Communication service | RIO scanner DIO scanner |
| Memory description | Expandable flash, 4 GB for data storage Integrated RAM, 10 kB for system memory Integrated RAM, 64 MB for program and data |
| Application structure | 2 auxiliary tasks 1 periodic fast task 128 event tasks 1 cyclic/periodic master task |
| Number of instructions per ms | 40 Kinst/ms 65 % Boolean + 35 % fixed arithmetic 50 Kinst/ms 100 % Boolean |
| Current consumption | 300 mA at 24 V DC |
| MTBF reliability | 775000 H |
| Marking | CE |
| Vibration resistance | 3 gn |
|---|---|
| Shock resistance | 30 gn |
| Ambient air temperature for operation | -25…60 °C |
| Ambient air temperature for storage | -40…85 °C |
| Operating altitude | 0...2000 m 2000...5000 m with derating factor |
| Relative humidity | 5…95 % at 55 °C without condensation |
| IP degree of protection | IP20 |
| Directives | 2014/35/EU - low voltage directive 2014/30/EU - electromagnetic compatibility 2014/34/EU - ATEX directive |
| Product certifications | CE UL CSA RCM EAC Merchant Navy ATEX zone 2/22 IECEx zone 2/22 |
| Standards | IEC 61131-2 IEC 61010-2-201 UL 61010-2-201 CSA C22.2 No 61010-2-201 IACS E10 EN/IEC 61000-6-5, interface type 1 and type 2 EN/IEC 61850-3, location G IEC 60079-0 |
| Environmental characteristic | Gas resistant class Gx conforming to ISA S71.04 Gas resistant class 3C4 conforming to IEC 60721-3-3 Dust resistant class 3S4 conforming to IEC 60721-3-3 Sand resistant class 3S4 conforming to IEC 60721-3-3 Salt resistant level 2 conforming to IEC 68252 Mold growth resistant class 3B2 conforming to IEC 60721-3-3 Fungal spore resistant class 3B2 conforming to IEC 60721-3-3 Hazardous location class I division 2 |
| Protective treatment | Conformal coating |
| Supply | Internal power supply via rack |
| Status LED | 1 LED (green) processor running (RUN) 1 LED (red) processor or system fault (ERR) 1 LED (red) I/O module fault (I/O) 1 LED (green) download in progress (DL) 1 LED (red) memory card or CPU flash fault (BACKUP) 1 LED (green/red) ETH MS (Ethernet port configuration status) 1 LED (green/red) Eth NS (Ethernet network status) 1 LED (green) I/O values overrided by user (FORCED IO) |
| Net weight | 0.849 kg |
| Unit Type of Package 1 | PCE |
|---|---|
| Number of Units in Package 1 | 1 |
| Package 1 Height | 9.000 cm |
| Package 1 Width | 17.900 cm |
| Package 1 Length | 25.200 cm |
| Package 1 Weight | 883.000 g |
| Unit Type of Package 2 | S03 |
| Number of Units in Package 2 | 6 |
| Package 2 Height | 30.000 cm |
| Package 2 Width | 30.000 cm |
| Package 2 Length | 40.000 cm |
| Package 2 Weight | 5.775 kg |
Schneider Electric aims to achieve Net Zero status by 2050 through supply chain partnerships, lower impact materials, and circularity via our ongoing “Use Better, Use Longer, Use Again” campaign to extend product lifetimes and recyclability.
Total lifecycle Carbon footprint
250
Environmental Disclosure
Use Better
Packaging made with recycled cardboard
Yes
Packaging without single use plastic
No
Pro-active compliance (Product out of EU RoHS legal scope)
SCIP Number
4eb70ab0-978b-4773-a441-0cc20d6144a1
REACh Regulation
Use Again
End of life manual availability
Take-back
No
CPU Module Only
Modules Mounted on Racks
a: additional space below the rack to accommodate the height of the CPU. For an X Bus rack, the value is 30.9 mm (1.217 in.); for an Ethernet rack, the value is 29.49 mm (1.161 in.).
b: the height of the rack. For an X Bus rack, the height is 103.7 mm (4.083 in.); for an Ethernet rack, the height is 105.11 mm (4.138 in.).
c: the height of the main local rack, 134.6 mm (5.299 in.)
Modules and Cables Mounted in an Enclosure
a: enclosure depth: 135 mm (5.315 in.)
b: wiring + module depth: > 146 mm (5.748 in.)
c: wiring + module + DIN rail depth: > 156 mm (6.142 in.)
d: rack height: for an X Bus rack 103.7 mm (4.083 in.); for an Ethernet rack, 105.11 mm (4.138 in.)
e: module height: 134.6 mm (5.299 in.)
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