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Mechanical Interlock for TeSys Giga contactor LC1G115-500 with LC1G115-500

LA9G970

Product compatibility:

Environmental Data
Use Better
Packaging made with recycled cardboard
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Recycled cardboard content is minimum 70% (50% in US). Some orders may include non-recycled cardboard until stock runs out.
Yes
Use Again
Take-back
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Whether the product has been included in a global take-back program. Some products are eligible in some geographies, please verify if it's available in your country.
No
Description
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These accessories are mechanical interlock for Tesys Giga contactor identical frame. To be used for reversing and changeover assemblings. Without electrical interlocking. It can cover -25°C to 60°C operation ambient air temperature, No derating up to 3000m altitude. Green Premium compliant (RoHs/Reach).
Specifications
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Main
RangeTeSys
Device short nameLA9G
Product or component typeMechanical interlock
Accessory / separate part categoryInterlocking accessory
Interlocking typeMechanical
Range compatibilityTeSys Giga
Product compatibilityLC1G115...500
LC1G205...475
Poles description3P
4P
Electrical circuit typeReversing
Star-delta
Changeover
Complementary
Height50 mm
Width80 mm
Depth120 mm
Net weight0.25 kg
Environment
Pollution degree3 conforming to IEC 60947-1
Operating altitude3000 m without derating
5000 m with derating factor
StandardsEN/IEC 60947-4-1
UL 60947-4-1
CSA C22.2 No 60947-4-1
GB/T 14048.4
Packing Units
Unit Type of Package 1PCE
Number of Units in Package 11
Package 1 Height5.300 cm
Package 1 Width8.200 cm
Package 1 Length18.300 cm
Package 1 Weight236.000 g
Unit Type of Package 2S02
Number of Units in Package 212
Package 2 Height15.000 cm
Package 2 Width30.000 cm
Package 2 Length40.000 cm
Package 2 Weight3.233 kg
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Schneider Electric aims to achieve Net Zero status by 2050 through supply chain partnerships, lower impact materials, and circularity via our ongoing “Use Better, Use Longer, Use Again” campaign to extend product lifetimes and recyclability.
Environmental footprint
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Materials and Substances
Use Again
Repack and remanufacture
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Documents
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Software and Firmware
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